BGA Assembly & X-Ray Inspection
Reliable placement and reflow of BGA, CSP, QFN and PoP packages, verified with X-ray inspection for voids, bridges and head-in-pillow defects.
Key Features
- Vision-aligned placement for BGA / µBGA / CSP / QFN / PoP
- X-ray inspection of hidden solder joints on every batch
- BGA rework and reballing station
- Underfill and corner-bond options for high-vibration products
- Void-rate reporting on request
Capabilities
| Min. BGA pitch | 0.35 mm |
| Max. ball count | 2,500+ |
| Inspection | 2D / 3D X-ray, AOI |
| Rework | Hot-air BGA rework, reballing |
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