Through-Hole (THT / DIP) Assembly
Wave soldering, selective soldering and hand insertion for connectors, transformers, electrolytic capacitors and other through-hole components.
Key Features
- Wave soldering with automatic flux spraying and preheat control
- Selective soldering for mixed-technology boards
- Skilled manual insertion and IPC-A-610 soldering for odd-form parts
- Press-fit connector assembly
- Post-solder cleaning and AOI inspection
Capabilities
| Processes | Wave, selective, manual soldering, press-fit |
| Board thickness | 0.6 – 4.0 mm |
| Standards | IPC-A-610 Class 2 / Class 3 |
| Mixed assembly | SMT + THT on the same board |
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